Products

G Series XRF is for analysis of precious metals, tin and nickel on PCBs, wafers, connectors and other electronic components.

Read more: Bowman Rolls Out G Series XRF

RO3003G2 high-frequency laminates provide radar sensor designers with improved insertion loss and reduced dielectric constant (Dk) variation.

Read more: Rogers Launches RO3003G2 High-Frequency Laminates

HSEC8 series high-speed edge card socket on 0.8mm pitch now has option of signal and power card edge combo connector.

Read more: Samtec Releases HSEC8-PV Series Socket/Connector Combo

Z-Planner v. 2018.1 PCB stackup software includes 14 new features and 12 new laminate systems.

Read more: Z-zero Launches Z-Planner v2018.1 PCB Stackup Software

Ultraminiature, thin-film transmission line capacitors have novel metal-insulator-metal (MIM) structure and a range of capacitance values. for high-frequency links, DC blocking in the UHF range (300MHz – 3GHz), and other high-performance microwave and RF applications.

Read more: AVX Introduces Transmission Line Metal Insulator Metal (MIM) Capacitors

E8M6151AL electrical tester has eight flying probes and is fully automated.

Read more: MicroCraft Adds E8M6151AL Probe Tester

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