R12-SP2 v. 13 multi-CAD interoperability software enables open standards for CAD/CAM/CAE software applications.
Z-planner PCB stackup planning software now has automated material matching utility.
Condura has new features for direct copper bonding (DCB) substrates to extend the lifetime of power electronics modules.
PostPro3DColor and PostPro3DMini machines are designed to smooth thermoplastic 3-D printed parts.
DKIH-EVB evaluation board is for DIY builds to achieve EMC filter specific to suppression requirements of unique application.
Sliver card edge connectors are now SFF-TA-1002 compliant.