Printed Circuit Design & Fab Online Magazine - Design News

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Quad Small Form Factor Pluggable Double Density (QSFP-DD) connectors, cages and cable assemblies address next-generation data center needs by increasing density through existing QSFP form factor to reach speeds up to 400Gbps.

Read more: TE Connectivity Releases QSFP-DD Connectors, Cages, Cable Assemblies

Sliver straddle-mount connectors for SFF-TA-1002 support faceplate-pluggable open compute project NIC 3.0.

Read more: TE Connectivity Introduces Sliver Straddle-Mount Connectors

Equipment Cleaner IV removes water hardness residues, photoresist scum and metal salt deposits from chemical processing equipment.

Read more: RBP Chemical Rolls Out Equipment Cleaner IV

DragonFly Lights-Out Digital Manufacturing (LDM) is an additive manufacturing platform for round-the-clock 3D printing of electronic circuitry.

Read more: Nano Dimension Introduces DragonFly LDM 3D Printer

DF51 series 2.0mm pitch wire-to-board connector now features a center lock design.

Read more: Hirose Offers Center Lock Design for DF51K Connectors

CFI features a unique metal terminal connection structure for direct connection between an automotive flexible printed circuit and the board.

Eliminates wire harnesses; permits use of fewer components and fewer assembly person-hours for vehicles, and makes room for improved design of automotive LED lights. Double-clip contact structure resists vibration, making it compatible with automotive applications such as LED lights and BMSs. Inertial lock structure prevents incomplete engagement, for reliability. Rated 2.0 A/pin max. Voltage: 50V DC. Ambient temperature: -40° to +125°C. Contact resistance: 20mΩ max. (initial). Insulation resistance: 100MΩ min. Dielectric strength: 1000V AC for 1 min.

Panasonic

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