EP2 tantalum capacitor is available with radial through-hole terminations with stud-mount option in B and C case codes.
Reactis stretchable film reportedly has excellent shape recovery and heat resistance.
PowerCu soft laser copper ribbons are for laser bonding in power electronic systems.
Condura.ultra Ag-free AMB substrate enables bonding silicon-nitride-based ceramics with copper foils.
ExpressPCB Plus v. 3.1 layout software expands ability to create complex, multipage schematics and fully validate PCB layout.
CircuitSeed thin, dense film is used as 3-D, finely patterned seed layers for subsequent metallization by plating.