Products

Murata Electronics North America introduces MAGICSTRAP, an advanced Radio Frequency Identification (RFID) Tag that can be attached onto a PCB. It is inductively coupled to the antenna that is integrated into the PCB. Because no electrical contact is needed, MAGICSTRAP adheres directly to the PCB using glue or sticky tape. The circuitry allows for the impedance matching feature, needed to cover the total UHF bandwidth while complying with the EPCGlobal C1 G2 standard. It features high tolerance against Electro Static Discharge over 10kV and measures only 3.2mm by 1.6mm.

 

www.murata.com

Applied Nanotech Holdings introduces CarbAl, a carbon-based metal nanocomposite heat sink material. Reported to be three times more effective at diffusing heat, the material is comprised of 20% aluminum and 80% carbonaceous matrix, and it has a thermal transmission near 500 W/mK. The material is lighter than the traditional metallic heat sinks and provides low-cost, high-quality heat sinks for the microelectronic industry.
 
www.appliednanotech.net
IRphotonics introduces the iCure AS200, an inline fiber optic system that provides thermal spot curing. The portable unit offers infrared radiation that is easily and quickly absorbed by thermal epoxies, resulting in faster and stronger curing. In addition, a light guide allows for precise and localized heating of bonded assemblies, and the automated manufacturing process eliminates the need for multiple thermal ovens, thus reducing costs.
 
www.irphotonics.com
GOEPEL electronic introduces CION Module/DIMM240, a digital low-cost module that allows for the testing of signal and voltage supply pins of JEDEC Std. Compliant DIMM240 sockets for DDR2-SDRAM. The module can be plugged into a respective socket, enabling the interface stages’ voltages to be adapted automatically. In addition, the module comes with a transparent TAP that allows several boards of the same or differing types to be cascaded in a Daisy Chain configuration. Additional features include safety mechanisms that prevent damage in case of shorts, extended power yield and voltage programmable TAP, and the module is supported by all JTAG/Boundary Scan controllers from the ScanBooster and SCANFLEX families.
 
www.goepel.com
Integrated Module Board technology permits smaller boards through adaptations to existing manufacturing processes. Components are embedded inside the core layer of the PCB, while being electrically connected directly to the conductors on top of the core layer. Can embed many types of components, including passives, bare die and wafer-level CSPs. Combines PCB manufacturing, component packaging and component assembly into one manufacturing sequence. Can be used to embed components inside a module substrate and manufacture a multi-chip-module / System-In-Package (SIP) product. Can be used to embed components inside a motherboard to manufacture a System-In-Board (SIB) product.

Imbera Electronics, http://www.imbera.fi

Mentor Graphics’ ECAD-MCAD Collaborator product enables bidirectional, digital communication of incremental design changes and automates the review and approval processes from design inception to manufacturing. Based on ProSTEP iViP Association-approved electromechanical interchange standard and developed in collaboration with PTC. Works in the Expedition Enterprise and Board Station XE PCB design flows, and PTC’s Pro/ENGINEER Wildfire 4.0 ECAD-MCAD Collaboration Extension.
 
Mentor Graphics, www.mentor.com  

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