Products

DfE Online is a training and certification program in Design for Environment. The self-paced program includes hundreds of case studies, cost-saving tips, energy-efficiency methodologies, and supply-chain strategies. Is a centralized source of technical and business information about substance impacts, material reduction methods, and end-of-life product strategies and tools for measuring environmental trade-offs and monetary ROI. Can be customized.

Technology Forecasters, www.techforecasters.com/dfe-online

EPL Bath is capable of plating 1:25 to 1:40 aspect ratio through-holes.

Read more: Uyemura Introduces High Aspect Ratio EPL Bath

FlexVIA completely self-contained vacuum plasma system treats innerlayers of flexible printed circuits boards prior to lamination, for improved adhesion and reliability. Features a dual-rack chamber that accommodates up to eighteen 20 x 24 inch panels in a single cycle. Both sides of the flex material surface area are treated in a single-step process enabling a rate of 80 to 120 units per hour. Features a space-saving, compact chassis 1651mm wide x 1283mm deep (65" x 94.5") and a horizontal electrode design to provide material alignment for uniform plasma treatment. Does not require use of temperature control, a blower or fluorine gases. Uses environmentally friendly gas plasma solutions such as argon and oxygen. Loads via two, optimum height, easy-access, front-loading doors with a maximum loading height of 1310mm (51.55").

Nordson March, nordsonmarch.com

 

VTOS Builder user-configurable verification and test OS provides a test platform for quick verification of new design and debug problems in embedded hardware.

Read more: Kozio Releases VTOS Builder Configurable Embedded Hardware Debug OS

Eagle software now connects users to local fabricators in Europe and the Americas, and prototype PCB assembly EMS companies in the Americas. Transfers design data automatically to the service partner's online quoting engine. Custom quote requests possible. Applies to Eagle v. 5.10 and higher.

CadSoft, www.cadsoftusa.com/downloads/ulps

Power Price+ calculates production cost and selling price of power components and modules. Evaluates IGBT, MOSFET and power diode technologies and module packaging technology. Provides wafer cost and power chip cost breakdown and evolutions, molded part cost breakdown and evolution, module cost breakdown, yields versus time, module manufacturing cost versus time, and module selling prices versus time. Lists 130 foundries from 79 companies and 22 countries; 60 assembly units among 27 companies and 18 countries; and 100 total manufacturers.

System Plus Consulting, www.systemplus.fr

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