Products

Chemask HT is a fast curing, peelable temporary spot mask formulated for long-term heat protection at elevated temperatures. May be used to protect pins, posts, contacts and edge connections in the solder reflow oven or during conformal coating processes. Chemask Aqua solder masking agent is a high-temp. temporary spot mask that protects component-free areas from molten solder during wave soldering. Is water-soluble, designed to be removed with open and closed loop aqueous cleaning systems, low foaming, and has no effect on deionized water system resin beds. Chemtronics, www.chemtronics.com

Macaos Enterprise v. 4.0 PCB management, panelization, stencil creation and online ordering software includes assembly data manager for adding or modifying pick-and-place data, bill of materials data, and graphical remarks for PCB. Expands support for sending an RFQ to EMS providers. Enhanced stencil creation module offers greater flexibility in the placement of data within the stencil frame, additional options for splitting a large opening into smaller openings or
changing the shape of an opening, and improved support for stencil creation scripts. Additional annotations have been added to panel drawings to show X and Y step distance and size and shape of all fiducials and bad marks. Now supports boards with up to 30 copper layers, Gerber files in the X2 format, and improved support for ODB++ files.

Macaos Software, www.macaos.com

 

UV700-SR1J electrically conductive silver paste enables the formation of electronic circuits using only ultraviolet curing, without thermal curing. Forms a circuit that carries current by printing a circuit on base material with silver paste using screen printing technology, and exposing it to UV light for around 10 sec., instantly hardening the printed film even at room temperature. Is said to enable narrower width than in conventional screen printing, resulting in the creation of micro wiring with a width of 70 microns and electrical resistivity of 10^(-4) ohm-cm on surface-treated PET film.

Tanaka Kikinzoku Kogyo,  http://pro.tanaka.co.jp/en

“JTAG | IJTAG Semiconductor and Board Test Security” is an eBook that addresses weaknesses in the IEEE 1149.1 Boundary-Scan (JTAG) standard’s test access port found on printed circuit boards and chips. Describes general security strategies based on the IEEE 1687 Internal JTAG (IJTAG) standard that can overcome these problems. Is available free.

Asset InterTech, http://www.asset-intertech.com/Products/Boundary-Scan-Test/BST-Software/JTAG-IJTAG-Semiconductor-and-Board-Test-Security

 

Antenna Magus v. 5.0  features  upgraded design capabilities for 250 antenna types. Automatically suggests practical design objectives and, as needed, instantly converts information provided by the designer between different representations. Features library of specifications, incorporating properties of typical design specifications used in various industries. Accepts user specification information for easy reuse. Chart tracing tool, which digitizes data from images of measurement or simulation plots, is integrated into the specification library, and includes automated extraction of representative properties such as beamwidth and sidelobe level. All elements of a design, such as parameter values and 3D images, can also be saved to file or clipboard in various text and image formats, providing easy access to resources for reporting. Integrates seamlessly into computational electromagnetic simulation tools (CST Studio Suite).

Magus, www.antennamagus.com

CST, www.cst.com

 

Integr8tor v8.3 sales and engineering server for auto input and design analysis is now available for download. Automatically downloads and analyzes incoming client design data; delivers quote-ready data to sales department, and design breakdowns with design-rule, DfM and capability checks to engineering and production departments. Offers a new tool that determines automatically whether holes should be drilled in sequential printed circuit boards using laser or mechanical means; analyzes characteristics such as hole size and type, and pad and ring size. Enables raft of additional layers to be analyzed automatically. Extra carbon layers, peel-off mask layers and legend layers can be analyzed automatically for characteristics such as minimum clearances and feature sizes. Analyzes solder mask layers for covered via holes. New features include expanded character sets for Asian users; bookmarks in the QED reports; improved edge connector recognition, and improved registration.

Ucamco, www.ucamco.com

 

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