Printed Circuit Design & Fab Online Magazine - Dow Develops Circuposit 6000 Electroless Copper Process

Printed Circuit Design & Fab Magazine

Circuposit 6000 electroless copper process is for high-reliability HDI circuit boards. Offers enhanced microvia reliability and improved performance.

Dow Electronic Materials, www.dowelectronicmaterials.com

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Dow Develops Circuposit 6000 Electroless Copper Process

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