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  • The Trade Show Connection

    The Trade Show Connection

    Finding community amid chaos.  READ MORE...

  • Understanding ANOVA

    Understanding ANOVA

    Analyzing process data for accurate, defensible decisions.  READ MORE...

  • High Yield Design Practices

    High Yield Design Practices

    Building with manufacturing limits in mind.  READ MORE...

  • Rigid-Flex Design

    Rigid-Flex Design

    Rigid-flex technology is redefining electronics design.  READ MORE...

  • PCB Thermal Challenges

    PCB Thermal Challenges

    When passive heat management isn’t enough.  READ MORE...

  • NTI-100: The World’s Top PCB Fabricators

    NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.  READ MORE...

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  • The Trade Show Connection

    Finding community amid chaos.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18980-on-flying-finding-and-the-trade-show-floor

  • Understanding ANOVA

    Analyzing process data for accurate, defensible decisions.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18981-the-analysis-of-variance-drawing-conclusions-from-data-that-are-correct-unambiguous-and-defensible

  • High Yield Design Practices

    Building with manufacturing limits in mind.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18979-tried-and-true-design-practices-for-high-pcb-yield

  • Rigid-Flex Design

    Rigid-flex technology is redefining electronics design.

    https://pcdandf.com/pcdesign/index.php/current-issue/289-best-practices/18976-why-rigid-flex-pcbs-are-an-untapped-design-solution

  • PCB Thermal Challenges

    When passive heat management isn’t enough.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook

  • NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18878-tracking-giants-inside-the-world-s-top-pcb-fabricators

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  • December North American PCB Shipments Down 5% YoY

MEPTEC Decides Program for Packaging Symposium

Published: 29 January 2009
 by Staff
SAN JOSE, CA – The MicroElectronics Packaging and Testing Engineering Council (MEPTEC) has finalized the program for its first-quarter symposium, “Semiconductor Packaging--Impacting the Age of Consumer Electronics.”
 
Held February 19, the event will begin with Ronald Steger delivering the keynote presentation. The topics of the symposium will address the most urgent areas of consumer products packaging.
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