Fab News

ROME, NY – The EOS/ESD Association has announced the release of its Technology Roadmap, which presents estimated threshold changes in electrostatic discharge (ESD) and the potential impact on ESD control practices through 2030.

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GURGAON, INDIA – Amber Group has signed a memorandum of understanding with South Korea's Korea Circuit to boost its PCB portfolio.

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TAIPEI – Taiwan's LCY Group has signed a business and capital alliance agreement with Nippon Denkai's US electrolytic copper foils subsidiary to offer a $9.5 million loan to support collaborations and share experiences in operations and expansions in the US.

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CHEONGJU, KOREA – South Korean PCB maker Simmtech has announced plans for a INR1,250 core ($150.5 million) investment in the Indian state of Gujarat to support Micron's semiconductor plant being built in the state.

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ESPOO, FINLAND – Aspocomp is lowering its net sales and operating result forecast for 2023 due to low net sales, weakened product mix and significantly higher material costs.

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ESPOO, FINLAND – Aspocomp COO and deputy CEO Antti Ojala has been appointed Chief Commercial Officer.

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