ENDICOTT, NY – Endicott Interconnect Technologies Inc. (EI) has been awarded a research and development contract by the US Department of Defense. The $12 million contract supports the continued development of advanced high-speed electronic packaging technologies, including printed circuit boards (PCBs), system development and substrate design.
 
EI has expanded and modified its existing facilities and purchased equipment to support the scheduled work. The company also plans to hire additional employees. “The work for the DoD needs to be performed within the boundaries of the United States, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel,” explains Rajinder Rai, vice president of R&D and general manager of Integrated Circuit Assembly Services at EI.

TOKYO and HONG KONG – Saki Corporation, a Japan-based provider of automatic optical inspection machines, has signed a Sale and Purchase (S&P) Agreement with Schmidt Electronics Group Ltd. In the agreement, Saki will acquire an undisclosed percentage of Schmidt’s subsidiary, MacroScience Technology Ltd. (MSTL).
 

A specific timeframe has not been given, but Saki will gradually acquire a majority interest in MSTL, while Schmidt retains a minority interest. In addition, Saki will assume management of MSTL operations. 
 
“MSTL will now be able to capitalize on the worldwide sales and marketing network of Saki Corporation to further increase its market presence and penetration. On the other hand, the valuable human and knowledge assets of MSTL will play an important part in Saki’s future business growth,” explained Klaus Festl, chairman and CEO of Schmidt.