Exopack Advanced Coatings’ Duratool Eclipse Micro Matte films reportedly use refined manufacturing and coating reformulations that incorporate more environmentally sensitive solvents.
In addition to claimed greater sustainability, the product reportedly
provides PCB makers with better chemical and scratch resistance, as
well as a high level of emulsion adhesion.
According to Greg Williams, VP at Exopack Advanced Coatings, “We are
using just two reformulated coatings which significantly reduce the use
of volatile organic compounds in the manufacture of these films."
Features of the new films include a claimed 100% camera inspection
coupled with automatic web marking, superior resolution of 1000
lines/mm, excellent densitometry and coatings on a 0.007-inch polyester
base for high stability and durability.
Engelmaier Associates presents the report Recommendations for
PCB FAB Notes and Specifications in Printed Circuit Board Drawings for
SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops
and Activities to Assure Continued Quality.
Version v.08 makes recommendations regarding appropriate
specifications and fabrication notes on drawings for printed circuit
boards, general procedures to qualify PCB shops, and testing procedures
to verify quality and reliability. Provides necessary material
selection information to supplement IPC-4101 slash sheets. Contains
recommended examples of fab notes for SnPb solder assemblies and
Pb-free assemblies, for use as general specifications on PCB drawings,
a basic questionnaire to supplement to IPC-1710 for qualifying PCB
shops, and recommendations for ongoing activities to ensure qualified
PCB shops maintain internal quality.
Agilent Technologies Inc. has released a limited access solution
for In-Circuit Test (ICT) users that reportedly eliminates the need for
physical test points. According to the company, Cover-Extend is
part of the VTEP v2.0 powered test suite, and is a hybrid between the
Boundary Scan test and VTEP Vectorless Test methodologies used in
electronic manufacturing.
Cover-Extend uses stimulus provided by boundary scan cells, which do
not require physical test points. The benefits include claimed improved
test coverage, savings on fixturing operating cost, and strain relief
on solder joints, resulting from fewer test probes needed underneath
high-density ICs (e.g., BGAs).
"Cover-Extend addresses key concerns in today's manufacturing
environment - cost, coverage, quality and speed," said Daniel Mak, VP
and GM of Agilent's Measurement Systems Division. "The results we are
getting from our customers' lines are very positive, and we will
implement Cover-Extend in full-scale production environments…in April."
Agilent will conduct live demonstrations of Cover-Extend at two major
test and inspection tradeshows: Apex 2008, April 1-3 in Las Vegas, NV,
and Nepcon Shanghai 2008, April 8-11, Shanghai, China.
Tech-Etch has released the “V” Series variable finger
snap-on BeCu gaskets for EMI/ RFI shielding. The company claims that by
reducing the number of full snap-on fingers on a strip, shielding
effectiveness is increased, since there are fewer gaps to close.
Claimed EMI/RFI shielding effectiveness is up to 100db attenuation.
Each gasket is reportedly offered in five slot patterns with a snap-on
mounting offering secure installation with high durability. The “V”
Series is used in bi-directional applications, requires only a low
closing force and closes gaps as small as .02”. Item numbers 187V32FXx,
250V37FXx and 282V60FXx are configurable to custom lengths.
Sunstone's Design For Manufacture (DfM) Add-On for Altium Designer is free and factory-certified. Implements the company's manufacturing capabilities interactively inside Altium Designer. Is said to reduce costs by reducing design errors; reduced time by using existing rule decks instead of user-created versions; and simplify design processes by following a factory-certified rule deck.
OptoTherm introduces the latest version of its EL Thermal Imaging System, which includes a new camera featuring a 320x240 detector array and claimed sensitivity greater than 0.05ËšC, as well as a 16 bit digital camera interface. The camera reportedly displays images at a rate of 30 frames/second with pixel resolution of 70 microns.
The company claims that the system can be used to locate shorts, stressed components and other defects, and can analyze the thermal behavior of individual components. The system includes all necessary mounting hardware, Thermalyze image analysis software, camera stand, and an I/O relay module.
