Printed Circuit Design & Fab Online Magazine - New Products

New Products

Ucamco introduces the FlashRip raster image processor. FlashRip is optimized for ripping and plotting very fine line images down to 4 μm features for HDI PCBs and chip-scale packaging substrates for BGA, FC-CSP and FC-BGA/LGA packages.

The company reports increases in throughput up to 100%, depending on plotter model and job complexity.

www.ucamco.com

Crydom, a subsidiary of Custom Sensors and Technologies, introduces the HS Series of solid state relay/heat sink assemblies. Available in either 280 VAC or 600 VAC, the assemblies are rated from 10 amps to 82.5 amps.

Features include 3 VDC to 32 VDC input control voltage, zero voltage turn on and output RC snubber networks. The dual and 3-phase assemblies are suitable for controlling most heating, motion or lighting loads.

www.crydom.com

Crydom, a subsidiary of Custom Sensors and Technologies, introduces the HS Series of heat sinks. Suitable for combined loads from 10 amps to 100 amps, the heat sinks can accept 1, 2 or 3 standard, single, dual or 3-phase solid state relays.

The heat sinks are designed for DIN rail or panel mounting and are available with thermal impedance ratings from 5.0 °C/W to 0.5 °C/W.

Accessories include thermal interface pads, clear touch safe SSR covers and heat sink mounting hardware.

www.crydom.com

Rogers Corp. introduces RO4730 LoPro laminates for base station, RFID and other antenna designs. The halogen-free laminate combines low-loss dielectric with low-profile copper foil for reduced passive intermodulation and low insertion loss.

The thermoset resin system incorporates a hollow, microsphere filler, producing a low density, which results in a lightweight laminate that is reported to be 30% lighter than woven-glass PTFE materials.

According to the company, the product has a matched dielectric constant of 3.0. It is also lead-free and automated assembly compatible.

Features include low z-axis CTE of about 40 PPM/°C and a temperature coefficient of dielectric constant of around 23 PPM/°C. The RO4730T LoPro has a high glass transition temperature greater than 280 °C, the same as the company’s other RO4000 laminates, and is compatible with standard PCB fabrication techniques and PTH processing.

www.rogerscorp.com

FKN Systek introduces the N100 Nibbler for singulating tab-routed printed circuit boards. Blades come in standard thicknesses of 0.120 inch, 0.093 inch and 0.062 inch, was well as custom sizes.

Because the N100 cuts tabs cleanly on each side, additional clean up isn’t required. During the process, only one tab is cut at a time so the panel isn’t pressed between two points during the cut, placing minimal stress on the board.

Features include a quick connect pneumatic port that plugs directly into factory air and a waste compartment that collects excess tab material.

www.fknsystek.com

Sigrity Inc. introduces XtractIM Version 3.0, establishing a new industry standard for IC package modeling. According to the company, this latest version enables designers to find weak pins with a push of a button.

The tool’s electrical performance assessment capabilities are extended with a signal net assessment analysis and results display. Self-impedance and coupling to other nets are computed and displayed, so designers are able to pinpoint performance issues in complex designs efficiently and intuitively.

Designers can assess performance of signal and power delivery nets, characterize a broader set of package types and extract electrical models with improved accuracy.

XtractIM Version 3.0 supports quad flat pack, quad flat pack no leads and VQFP. It provides both a practical assessment method for complex SiP power delivery nets and support for single-die packages.

www.sigrity.com