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  • Thermal Vias are Ineffective. Here’s Why.

    Thermal Vias are Ineffective. Here’s Why.

    Adding thermal vias can take up valuable board space with little benefit.
      READ MORE...

  • Connecting the Industry, from Boards to Assemblies

    Connecting the Industry, from Boards to Assemblies

    HDP is embarking on new rounds of evaluations of laminates and lead-free solders.
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  • Exploring the Impact of AI

    Exploring the Impact of AI

    A special panel discusses the growth of AI tools and its possible effects on the industry.
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  • A Journey in Rigid-Flex Design

    A Journey in Rigid-Flex Design

    Overcoming the challenges of rigid-flex designs can be incredibly rewarding.
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  • Creating the Ultra Library

    Creating the Ultra Library

    Building and maintaining what's said to be the world's largest CAD database requires strong relationships.
      READ MORE...

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  • New Products

New Products

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Daat Research Corp. introduces Coolit v.9 thermal & flow analysis software. Reported to shorten modeling times, users can choose from several methods to build complex IC chip models.

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EMA Design Automation introduces the TimingDesigner 9.2, which interfaces with Cadence Allegro PCB signal integrity (SI) technology.

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PSR-4000 LDI (US) laser direct imageable solder mask is said to have fast exposure, requiring as little as 50-100 mj. Reportedly produces quality imaging with straight sidewalls, fine feature resolution and registration. Has a rich green color, satin surface finish and is low halogen. Can be exposed in conventional flood exposure units. Meets IPC-SM-840D and UL 94. 

Taiyo America, www.taiyo-america.com

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Siemens PLM Software introduced NX PCB Exchange for Zuken PCB design software. The product provides direct data exchange between NX and Zuken’s CR-5000 Board Designer PCB layout software.

NX PCB Exchange facilitates mechanical and electrical design collaboration throughout the product development process. Creates a direct link between MCAD and ECAD. Generates 3-D assembly models of the PCB and components from Board Designer data and makes them usable by all NX applications for design review and simulation. Allows bending or flattening of a board design for assembly parts. Data such as the board outline, component placements, hole placements, patterns, masks, resists and pads can be bidirectionally transmitted between Board Designer and NX.

www.plm.automation.siemens.com

www.zuken.com

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Nextreme Thermal Solutions introduces the eTEC Thermoelectric Cooling Kit. Features include a single UPF40 thermoelectric module, and air-tight cooling environment and electrical connectors for accurate temperature measurements of thin-film thermoelectric devices.

The UPF40 module allows for precise cooling and temperature control of opto-electronic applications with high heat-flux requirements in very small packages (laser diodes, high-brightness LEDs, VCSELs).

The kit provides a full thermal path while needing only an adjustable power supply, a volt meter and a two-channel, type K thermocouple readout to measure temperature differentials.

 

www.nextreme.com

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