EN AT5600 electroless nickel plating is said to eliminate black pad and improve soldering on ENIG-coated PCBs. Provides lateral growth on copper, reportedly yielding a flatter surface with less pronounced grain boundaries. Features an additive system that produces solution stability throughout its bath life.

Technic, www.technic.com 

Stellar IP automates FPGA image creation by reusing proven IP cores.

Ansys 14.0 engineering simulation technology suite optimizes product development processes. Includes ANSYS Workbench; tighter integration brings more physics applications together to power simulation efforts. Benefits include amplifying engineering: automates many user-intensive operations; simulating complex systems: allows engineers to simulate complexity as it exists in the real world, from a single component to entire systems; high-performance computing: capitalizes on modern hardware advancements to deliver complex simulation calculations quickly. Integrates Composite PrepPost with other structural simulation capabilities in Workbench. Automated algorithms and weighting options have been enhanced. Fluent cosimulation link with Simplorer analyzes battery systems without neglecting nonlinear behavior of the fluid system. Introduces two-way electromagnetic coupling with stress analysis and the ability to resimulate the electromagnetic field distribution on the deformed geometry.

Ansys, www.ansys.com 

UVP-630A edge coating system applies a formulated UV curable coating to the edges of LED substrates to prevent chemical attack during panel processing.