PCBBalance evaluates the impact of a specific board/panel layout on the copper plating step during manufacturing.

Simulation is carried out either on a virtual plating line, or on a digital twin of an in-house plating line. Jobs with various board/panel layouts can be simulated to compare plating uniformity and select optimum configuration. Identifies potential plating issues upfront. Embedded single-click balancing algorithm defines optimal copper balancing layout.



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