Log in / Register
  • What is Ultra HDI?

    What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.  READ MORE...

  • The Critical Nature of PCB Stackup

    The Critical Nature of PCB Stackup

    The stackup supports every layer above it.  READ MORE...

  • The PCB Design Review Process

    The PCB Design Review Process

    A structured design review process ensures alignment.  READ MORE...

  • Metal-Core PCBs and Thermal Management

    Metal-Core PCBs and Thermal Management

    Catch heat at the board.  READ MORE...

Homepage Slideshow
  • Home
  • Education
  • New Products
  • Applied Simulation Technology Upgrades ApsimRLGC Field Solver

DuPont Introduces Interra FL Laminate

Published: 10 March 2016

Interra FL is a copper-clad no-glass laminate for rigid fine-line applications. Is a polyimide film laminated on both sides with low-profile electrodeposited copper for use in multilayer rigid circuit boards. Is suitable for HDI applications. Is compatible with standard PWB processing of thin copper clad laminates. Has a dielectric thickness of 2µm, dielectric constant of <3.5, and low loss tangent of <0.003.

DuPont, www.dupont.com

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article