January 11, 2018 – Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is pleased to announce that Thomas Michels (Managing Director, Ventec Europe) has been elected to the Board of Directors of the EIPC, effective immediately. Mr. Michel’s appointment expands the Board to 15 members from around Europe who as a group continue to accurately reflect the role of the Institute throughout the value chain of Europe's electronic packaging and interconnection industry.
Flex and rigid flex circuit board manufacturer, Printed Circuits has started 2018 with a few enhancements to their wet processing department, starting with the appointment of Paul Peters to engineering manager of their plating and wet processing departments.
ISO 14001 International Certification Recognizes Fulfillment of Environmental Objectives
Prototron Circuits has chosen Frontline InSight PCB Pre-CAM Assessment Solution to complement its CAM operation.
Ventura, CA – January 9, 2018, Techniplas, a leading global design and manufacturing provider of automotive products and services, today announced that Nano Dimension, a leading additive electronics provider (NASDAQ, TASE: NNDM), joined its open innovation program to make available for the first time to the automotive industry additive manufacturing of conductive components, encapsulated sensors and smart surfaces.
San Jose, CA: Zero Defects International [ZDI] has announced their participation as an exhibitor at the SMTA Rocky Mountain Expo and Tech Forum. It will be held at the West Club in Mile High Stadium, home of the Denver Broncos. The date of this event is Thursday, January 25th. The address of the West Club is 1701 Bryant Street, Denver, Colorado.