BANNOCKBURN, Ill., USA, February 11, 2020 — Three IPC volunteers who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts, were presented with Dieter Bergman Fellowship awards at IPC APEX EXPO 2020. Mike Carano, Bhanu Sood and Udo Welzel were chosen as award recipients because they embody the work ethic and spirit of the late Dieter Bergman, a pioneer and industry icon. They will bestow Dieter Bergman Memorial Scholarship awards on the university or college of their choice.
Mike Carano, RBP Chemical Technology, Inc., has published more than 190 technical articles and is the holder of nine U.S. and 22 international patents. An active IPC volunteer for nearly 30 years, Carano is co-chair of the IPC Technology Roadmap Executive Committee, chair of the IPC Process Effects committee and IPC Technology Solutions Committee. A frequent lecturer at IPC events, Carano also served on IPC’s Board of Directors. Carano has chosen his alma mater, Youngstown State University, Youngstown, Ohio, as recipient of the scholarship.
Bhanu Sood, Ph.D., NASA Goddard Space Flight Center, lends his expertise to nearly four dozen technical committees, including serving as chair of the D-55 Embedded Circuitry Guideline task group. He’s been an avid presenter at IPC Days in the U.K. France and the Netherlands, several consecutive high reliability forums and presented at IPC CEMAC in Shenzhen, China, last August. He has authored several hundred conference papers, presentations and technical reports, is a member of the editorial board of SMT Journal and is an active volunteer in committees and standards development not only for IPC, but SAE and IEEE as well. Dr. Sood selected the department of aerospace engineering at the University of Petroleum and Energy Studies in Dehradun, India, as the recipient of this year’s Dieter Bergman Memorial Scholarship award.
Udo Welzel, Ph.D., Robert Bosch GmbH, is deeply involved in global standardization activities for IPC and IEC. At IPC, he serves as co-chair of the 5-21 Cold Joining Press Fit Task Group and 7-31bv IPC A-610 Automotive Addendum Task Group, along with 18 additional IPC technical committees. Dr. Welzel has chosen the Technical University (TU) in Darmstadt, Germany as recipient of the scholarship.
“The recipients of this year’s Dieter Bergman Fellowship award are leaders in the field and are making a global impact on our industry. We are indeed fortunate that they have chosen to volunteer their considerable talents and expertise with IPC and the electronics community,” said John Mitchell, IPC president and CEO.