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  • Onderdonk's and Preece's Equations: How Do They Compare?

    Onderdonk's and Preece's Equations: How Do They Compare?

    Two unique equations can be used when fusing a trace – each offering its own strengths and weaknesses.
      READ MORE...

  • Simulating Electronics Components in the Cloud

    Simulating Electronics Components in the Cloud

    Methods for assessing component temperatures and fan performance.
      READ MORE...

  • Cpk or Ppk? A Look at Using Both Capability Indices

    Cpk or Ppk? A Look at Using Both Capability Indices

    Summary statistics can be misleading, but in different ways.
      READ MORE...

  • The West is Rediscovering India

    The West is Rediscovering India

    The subcontinent explodes with new EMS work, prompting a spate of IPOs.
      READ MORE...

  • Thermal Considerations for Printed Circuit Board Designers

    Thermal Considerations for Printed Circuit Board Designers

    Leave more metal behind.
      READ MORE...

Homepage Slideshow

  • Onderdonk's and Preece's Equations: How Do They Compare?

    Two unique equations can be used when fusing a trace – each offering its own strengths and weaknesses.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17314-onderdonk-s-and-preece-s-equations-how-do-they-compare

  • Simulating Electronics Components in the Cloud

    Methods for assessing component temperatures and fan performance.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17315-simulating-electronics-components-in-the-cloud

  • Cpk or Ppk? A Look at Using Both Capability Indices

    Summary statistics can be misleading, but in different ways.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17313-cpk-or-ppk-a-look-at-using-both-capability-indices

  • The West is Rediscovering India

    The subcontinent explodes with new EMS work, prompting a spate of IPOs.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17316-the-west-is-rediscovering-india

  • Thermal Considerations for Printed Circuit Board Designers

    Leave more metal behind.


    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/17308-thermal-considerations-for-printed-circuit-board-designers

Tweets by @FrancesStewart5
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  • March 2014 Articles

March 2014 Articles

Published: 17 March 2014
Mike Buetow

CAVEAT LECTOR

Broken eggs.
by Mike Buetow
Peter Bigelow

ROI

The future in 3-D.
by Peter Bigelow
E Jan Vardaman

ON THE FOREFRONT

Organic substrates.
by E. Jan Vardaman
Pi Zhang

DESIGNER'S NOTEBOOK

SI with HDI.
by Pi Zhang
 Mark Finstad  

THE FLEXPERTS

Designing for flex.
by Mark Finstad
 Karl Seelig  

TECH TIPS

Flux standard in flux.
by Karl Seelig and Tim O’Neill
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