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  • How the PCB Stackup Helps Control EMI

    How the PCB Stackup Helps Control EMI

    Power and signal placed on outer layers minimize radiated emissions.
      READ MORE...

  • Century Circuits

    Century Circuits

    Which PCB technologies are best suited to survive 100 years?
      READ MORE...

  • Learning from the Past

    Learning from the Past

    What history can tell us about our position in high-tech.
      READ MORE...

  • Thermal Vias are Ineffective. Here’s Why.

    Thermal Vias are Ineffective. Here’s Why.

    Adding thermal vias can take up valuable board space with little benefit.
      READ MORE...

  • Connecting the Industry, from Boards to Assemblies

    Connecting the Industry, from Boards to Assemblies

    HDP is embarking on new rounds of evaluations of laminates and lead-free solders.
      READ MORE...

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2017 Magazine Archives

October 2017 issue

Published: 12 October 2017

1710cover

 

FEATURES

EMC ANALYSIS
Adding Automated EMC Analysis to PCB Layout
There is a perception that EMC analysis during layout can be a time-consuming task that is challenging to set up and properly configure, with difficult-to-interpret results. But conducting EMC analysis at appropriate points prior to fabrication can mitigate the need for redesigns.
by Craig Armenti

PLATING
Black Pad Revisited
Black pad is often the root cause of solderability issues. How do you differentiate it from other soldering defects?  And why should you care?
by Martine Simard-Normandin and Christina Banks

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

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