LCP Laminates are adhesiveless and film-based, for semiconductor packages and coreless designs up to 6 layers as well as in combination with other rigid materials as hybrid circuits. Start with Rogers Ultralam 3000 materials, for low dielectric constant and dissipation factor for RF designs. Tolerate high levels of radiation exposure

Endicott Interconnect Technologies, www.eitny.com

 

 

Fabric Shielding Gasket line includes more than 125 profiles and sizes.

Read more: Leader Tech Launches FSG Shielding Gaskets

FAB 3000 v.5 CAM software runs DRC/DfM verification, edits and outputs Gerber data, compares nets, merges PCBs, and generates part centroid files.

Read more: Numerical Innovations Releases FAB 3000 v5

DART technology is used in conjunction with CAD/CAE support services. Increases accuracy and speed of migration, conversion and translation initiatives. Migrates legacy data to new EDA technology platforms. Reduces manual verification processes.

AcAe, www.acae.com