Sherlock 3.0 automated design analysis software is for analyzing, grading and certifying the expected reliability of products at the circuit card assembly level. Includes a global parts database with private cloud storage; 3D FEA model and 3D viewer for ICT and shock and vibration analysis; sub-assembly analysis to attach one or more printed circuit board subassemblies to the primary circuit board; improved result management functionality, and embedded failure rate models. 

DfR Solutions, www.dfrsolutions.com

Vault 1.1 features enhanced searching and filtering tools and design bill of materials for easy-to-use component navigation.

Read more: Altium Upgrades Vault 1.1

Altium Designer 13.2 offers better control over printed circuit board design data and a clearer view throughout the development process.

Read more: Altium Releases Designer 13.2

Ultra thin double coated tapes are for bonding and attaching components and assemblies where high dielectric strength is required. REACH and RoHS compatible. Come in polyimide (PI) and polyester (PET). Have dielectric strengths up to 13.2kV. Include acrylic and silicone adhesives with a variety of liners for die cutting into complex shapes and auto application. Halogen-free UL94 VTM0 flame-retardant and antistatic versions also available. Antistatic versions have peel voltages of <100v and surface resistances of 10^5 to 10^9 Ohms.

Polyonics, www.polyonics.com