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Semiconductor Manufacturing and Test Equipment (Worldwide)

 by SEAJ, SEMI

Monthly report tracking billings and bookings (book-to-bill) worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices (does not include billings and bookings of semiconductors). Categories covered include front-end (wafer processing/mask/reticle/wafer manufacturing/fab facilities) equipment and final manufacturing (assembly/packaging/test) equipment. Data are provided on a 90-day moving average basis. This is considered a leading indicator of future printed circuit board and electronics assembly orders. Compiled by Semiconductor Equipment Association of Japan, SEMI and SEMI Japan.

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