Who Needs S-Parameters?
Consider these alternatives for advanced PCB design and analysis. READ MORE...
Automating High-Speed Constraints
IC vendors should make edge rates easily available for inclusion in PCB design libraries READ MORE...
What's Next for Portable Product Designs
SLPs with lines and spaces READ MORE...
How to 'HDI'
Why a 3-N-3 stackup is the sweet spot. READ MORE...
The Case for a 1.1mm BGA/CGA Package
A marginally larger package would cut design times and improve PCB yields and performance. READ MORE...
From the Archives: 5 Common Mistakes in Board Design
As often as not, not understanding assembly leads to problems in design. READ MORE...
How Big is Your Moat?
If the clearance is not at least 10 mils, yields may drop. READ MORE...
Consider these alternatives for advanced PCB design and analysis.
IC vendors should make edge rates easily available for inclusion in PCB design libraries
SLPs with lines and spaces <35µm are ahead.
Why a 3-N-3 stackup is the sweet spot.
A marginally larger package would cut design times and improve PCB yields and performance.
As often as not, not understanding assembly leads to problems in design.
If the clearance is not at least 10 mils, yields may drop.
Printed Circuit Design & Fab Magazine
A new policy for tech planning is needed.
The pandemic created a unique environment for finding talented employees.
Without successful R&D in the electronics industry, successful manufacturing is not possible.
How to design for HDI.
John Burkhert Jr.
How previous industrial revolutions can help us approach this one.
Striking the right balance between costs and cycle time.
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