TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates.

The new line will come online in January and is designed to support high-end FC-BGAs, large-scale, multilayer substrates needed for AI and data center semiconductors.

The production capacity at the Niigata plant will double the fiscal 2022 first half level, with the new line employing copper wiring surface treatment to account for skin effects during high-speed signal transmission. Additionally, the line will support production of sizes too large for JEDEC-standard-compliant trays, and inspection processes will be enhanced to increase yield rate.

Autonomous mobile robots will be adopted for transfer between certain processes, reflecting broader "smart factory" efforts in substrate manufacturing.

• Next