WASHINGTON -- The Department of Defense today announced an award of $46.2 million to GreenSource Fabrication to enhance existing production capabilities at a manufacturing facility of state-of-the-art integrated circuit (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), and advanced packaging.

The grant was made as part of the recently signed Defense Production Act Investment (DPAI) Program.

"Reshoring advanced packaging and assembly are essential to increase semiconductor supply chain security," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy. "Expanding domestic production capability for printed circuit boards and advanced packaging is necessary to avert a shortfall that would severely impair national defense capability."

The award will enable GreenSource to scale up engineering, tooling, and manufacturing operations to establish a dedicated facility for IC substrate fabrication for a high-mix, low-volume offering of advanced interconnect solutions. These domestic production capabilities for HDI, UHDI, IC substrates, and advanced packaging are critical enabling technologies for sixth-generation systems and applications, including for radar, electronic warfare, information processing, and communications.

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