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Design News

Details: Written by Staff; Category: Design News; Published: 25 June 2008

MARLBOROUGH, MA - Flomerics' Flotherm software has helped Redback Networks with the cooling problems involved in Redback's first broadband, phone and TV subscriber platform.

"The power dissipation of the line cards in the new platform had to be increased by 2X …to obtain the planned improvement in performance and functionality," said Wendy Lu, engineer for Redback. "By focusing on reducing the chassis static pressure via geometry changes and using a higher performing fan, we were able to double the airflow in the chassis."

Lu utilized Flotherm's software to evaluate plenum geometry to obtain the required level of airflow. Then, using the software's generated board model, she ran simulations on the model to ensure that critical components could be cooled to within specifications.

Lu then commissioned a foamcore model of the newly designed plenum so that physical tests could be performed, and lab measurements closely matched the simulation results, with no design changes required for the prototype. The new platform will go into production and has already been selected by one of the top 20 telephone carriers in the world, ChungHwa Telecom of Taiwan.

Details: Written by Staff; Category: Design News; Published: 24 June 2008

BEIJING, CHINA - Magma Design Automation has announced that it will open offices in Beijing and Shanghai, adding 18,000 square feet of office space in the two cities, and expand its IC R&D team to provide local customer support. The company reported that it has also launched a university program partnership with the Chinese government.

"Driven by computing and consumer electronics demand, the Chinese semiconductor market is projected to surpass $28 billion in 2011," said Rajeev Madhavan, CEO of Magma. "Doing business here requires an understanding of the dynamic characteristics of the Chinese market, the role of the government and the differences in business practices."

The company stated that its program with local universities will increase the local engineering talent pool and foster research. It will provide course material, software and support, and contribute to design automation research labs. Sarah Xu, Ph.D. has been appointed as managing director, and will act as liaison to universities and EDA partners.

"China is putting strong emphasis on engineering education and software development," Xu said. "We are pleased to support these efforts by working with local universities to train engineers... and contribute to important research."

"We've worked closely with Magma in a number of areas including an internship program and joint research program," said Yici Cai, professor at the Tsinghua University Computer Science Department. "With this successful collaboration as a foundation, we look forward to extending our relationship through the formal university program."

The company established its first facility in Beijing in 2003.

Details: Written by Staff; Category: Design News; Published: 24 June 2008

LONDON - Mentor Graphics has resubmitted its unsolicited offer of approximately $46 million for the Flomerics Group, a bid that Flomerics has already rejected as too low.

SEASIDE, OR - Written by Joseph Fjelstad in September 2006, the 3rd Edition of the book Flexible Circuit Technology features new chapters and authors that include: Flex Circuit Design Guide for Static and Dynamic Flexing by Werner Engelmaier of Engelmaier Associates, Process Challenges and System Applications in Flex by Kevin Durocher and William Burdick of GE Research, Flexible Circuit Assembly by Bob Willis of the SMART Group, and Solderless Assembly Processes for Flexible Circuits by Joe Fjelstad, developer of the Occam Process.

Reportedly to help assist in the adoption and implementation of flex circuit interconnection technology, the book and new chapters are available free of charge. PDF versions of both can be downloaded at flexiblecircuittechnology.com.

According to the book's sponsors, the new chapters were written to address needs of both the newcomer and experienced engineer, while introducing new applications of the technology. Topics include new chip packaging and interconnection solutions, emerging printed electronics technologies, RFID and other applications.

The book is published by BR Publishing of Seaside, Oregon.