Printed Circuit Design & Fab Online Magazine - Design News

Design News

Details: Written by Staff; Category: Design News; Published: 07 April 2009

SAN JOSE, CA – Sales of EDA tools in the fourth-quarter fell 17.7% from last year to $1318.7 million, and the moving average dropped 9.4%, on declines in CAE, PCB/MCM and IC physical design and verification, the EDA Consortium said.

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Details: Written by Staff; Category: Design News; Published: 06 April 2009

YAVNE, ISRAEL –Valor Computerized Systems Ltd. has released Enterprise 3000, version 8.2, an automated DFM verification tool for PCB design.

According to Valor, version 8.2 introduces significant improvements to overall system performance. On average, processing time is reduced by 25% due to improvements made to the analysis algorithms. In addition, improvements in memory management enable analysis of larger designs than previously possible. The new version also incorporates functionality that improves the system’s ease-of-use, simplifies the DFM analysis preparation process and improves upon filtering capabilities.

Version 8.2 provides additional new analysis verification for HDI designs through the integration of net integrity, electrical return path, and via stack count for HDI designs. “Via Stack Count” verification is used to locate likely microvia fractures and return path validation. Version 8.2 also enables wire bond and die pad netlist validation.

A new design preparation rule set module makes preparing a design an order of magnitude faster and easier than using traditional automation techniques. Attributes are now provided with a complete and meaningful name, making it easier for DFM users to set-up and be productive.

The analysis for thermal impact of embedded pads has been improved to calculate the percentage of perimeter for the covered area to minimize incorrect identification of DFM issues.

The Enterprise 3000 DFM software provides a virtual manufacturing system that can simulate the entire PCB production process, concurrent with the design process, reducing respins, lowering the cost of new product design and improving overall quality.

Details: Written by Staff; Category: Design News; Published: 01 April 2009

SAN JOSE, CA – Cadence Design Systems has entered the world of blogging with the launch of "Industry Insights."

Hosted by journalist Richard Goering, the blog encourageS discussion on topics pertinent to the electronics design community. It can be accessed at: www.cadence.com/community/blogs/ii.

“The blog will provide an enhanced platform for peer-to-peer dialogue and commentary on the many issues, challenges and innovations that impact engineers and design managers in their everyday work,” said Adolph Hunter, vice president of corporate marketing.

Details: Written by Staff; Category: Design News; Published: 01 April 2009

EAST WALPOLE, MA – Hollingsworth & Vose introduces ViaMat, nonwoven aramid paper. It is reported to improve dimensional stability and to enable higher interconnect densities in electronic packaging applications.

The fibers are randomly aligned, creating an isotropic nonwoven paper that allows for uniform density and resin pickup. A low CTE provides dimensional stability, and the surface smoothness allows uniform resin application.

Saturation of the product can be processed on most existing glass resin saturation lines with minimal cost. Interconnect density is increased over industry standard woven materials because of the product’s laser/plasma ablation and drill ability.

SANTA CLARA, CA – Agilent Technologies Inc. named Ron Nersesian senior vice president and general manager of its Electronic Measurement Group (EMG). Prior to his appointment, he was vice president and general manager of EMG’s Wireless Business Group.

In his new role, he will oversee business operations of the Electronic Measurement and Semiconductor & Board Test segments.

Nersesian brings almost 30 years of experience in engineering, marketing and general management. Prior to joining Agilent, he worked for high-tech companies including Hewlett-Packard.

“Ron’s experience and strong record of performance make him ideally qualified to lead EMG, particularly as we navigate through difficult economic times,” said Bill Sullivan, president and CEO.

CHICAGO – Newark has launched a 500-page print catalog to provide engineers with the latest technologies and solutions in design development.

The catalog contains board-level components from leading suppliers. With over 32,000 products, including wire, interconnect and industrial control products, Newark also offers an interactive online version available at: www.newark.com/ecats.

“This new catalog meets the needs of design engineers seeking one source for new technologies and best-in-class products and suppliers,” comments Barry Litwin, senior vice president of marketing. “It represents a carefully edited subset of new and proven product solutions to help inspire new ideas for design.”