Design News

YAVNE, ISRAEL – Valor Computerized Systems has obtained the assets of PCB Matrix Corp. The acquisition expands Valor’s product portfolio of PCB design solutions; PCB Matrix customers will be able to access Valor’s global support services. 

PCB Matrix was a partner with IPC in the development of IPC-7351 Land Pattern standards, and the LP Wizard land pattern generation software was awarded the DesignVision Award at DesignCon 2007.

“We believe the industry will benefit from a streamlined library creation process that has the potential to incorporate manufacturing knowledge into the EDA libraries. This will ultimately lead to more manufacturable designs the first time through,” said Patrick McGoff, vice president of design market at Valor.
PISCATAWAY, NJ – Mentor Graphics recently received the IEEE Standards Association (IEEE-SA) 2008 Corporate Award. The honor acknowledges Mentor’s “visionary leadership in bringing greater efficiency to the standards development process in the Design Automation Standards Committee through the adoption and support of the entity based development model.”
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MARLBOROUGH, MA – DownStream Technologies LLC announced that it has begun shipping CAM350 Release 10 and BluePrint-PCB Release 2. In addition, the company is offering the two products for download. After extensive development, integration between the products is complete, providing a synergistic solution for PCB post-processing.
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MUNICH, GERMANY and WESTFORD, MA – Zuken introduces a simulation design kit for Xilinx Spartan-3 FPGAs. The company is offering the kit free of charge to customers with maintenance agreements.
 
The design kit contains CR-5000 Lightning, the company’s high-speed design environment. It includes simulation models, net topology templates and associated documentation.
 
The kit allows engineers to quickly evaluate signal integrity of memory I/O without extensive preparation. 
DARMSTADT, GERMANY – Computer Simulation Technology (CST) has announced the winners of the CST University Publication Award. The annual grant rewards university institutes and researchers for work in 3D EM field simulation.
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SAN JOSE, CA – The MicroElectronics Packaging and Test Engineering Council in February will sponsor a symposium on semiconductor packaging’s effect on consumer electronics.
 
The technical event will address packages for consumer products, with session topics including time-to-market and consumer semiconductor packaging; cost-of-ownership challenges for consumer products; solutions for consumer product miniaturization, and advancing technologies for consumer electronics.
 
It takes place Feb. 19 in San Jose. For more information, visit www.meptec.org.

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