PEACHTREE CITY, GA – The Printed Circuit Engineering Association (PCEA) today announced Louis Feinstein of Dassault Systèmes will keynote the PCB West conference and exhibition in September.

Louis-FeinsteinFeinstein’s talk, Revolutionizing Electronics Cyber-Physical Systems: Unleashing the Power of MBSE and AI for Electronics System Design, focuses on the next paradigm in Electronics Cyber-Physical Systems (ECPS) development. His talk takes place September 20 from 11 a.m. to 12 p.m., and is free to all conference and expo registrants.

By leveraging model-based systems engineering (MBSE) and artificial intelligence (AI), we accelerate the design of electrical and electronic systems. MBSE streamlines integration, while AI-driven optimization ensures alignment with design intent and derived requirements. The synergy of MBSE and AI empowers efficient ECPS development, establishing new benchmarks in quality and speed. A use case will be showcased to validate the approach, paving the way for the future of ECPS.

Feinstein is High Tech Industry Strategy Director, High-Tech at Dassault Systemes. He is a seasoned executive and visionary engineer with profound knowledge and experience in the high-tech market. His current role at Dassault Systèmes involves the global management of High Tech Solutions within the Dassault Systèmes portfolio. His responsibilities encompass product strategy, global market development, technology acquisitions, strategic partnerships, and technology roadmaps for the High Technology portfolio of products and solutions.

“Lou Feinstein’s diverse background, which ranges from design systems to the assembly floor at leading companies like Dassault Systèmes, Textron and EMC, makes him ideal to explain the impacts of the array of coming technologies on the day-to-day operations of almost every engineer and production staffer,” said Mike Buetow, president of PCEA and conference chairman, PCB West 2023.

PCB West, the leading technical conference and exhibition in North America for electronics design, fabrication, assembly and test engineers, takes place September 19-22, 2023, at the Santa Clara (CA) Convention Center. The event includes a one-day exhibition on September 20.

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