New Products

Reactis stretchable film reportedly has excellent shape recovery and heat resistance.

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PowerCu soft laser copper ribbons are for laser bonding in power electronic systems.

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Condura.ultra Ag-free AMB substrate enables bonding silicon-nitride-based ceramics with copper foils.

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ExpressPCB Plus v. 3.1 layout software expands ability to create complex, multipage schematics and fully validate PCB layout.

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CircuitSeed thin, dense film is used as 3-D, finely patterned seed layers for subsequent metallization by plating.

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CircuitWrap ink is used as bezel/wrap electrodes in touch-panel displays and micro/miniLED panels.

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