Techni IM Gold AT8000 non-cyanide immersion gold is said to improve solderability while reducing gold usage when compared to typical cyanide based ENIG chemistry. Slows and controls deposition of gold on electroless nickel, reportedly eliminating corrosion products and creating a pore-free ENIG deposit with better solder spread. Controlled deposition provides more uniform plating thickness across different pad sizes. Substantial gold savings possible due to combination of tighter thickness distribution and thinner gold deposits. Technic TechniIMGold

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