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  • Tolerances and Dimensions for PCB Fabrication

    Tolerances and Dimensions for PCB Fabrication

    The tolerances decide what actually ships.  READ MORE...

  • How to Avoid 'Ghost Manufacturing'

    How to Avoid 'Ghost Manufacturing'

    Hidden subcontracting can expose providers to latent quality risks.  READ MORE...

  • Flex Circuits for Use in Catheters

    Flex Circuits for Use in Catheters

    Long, narrow flex circuits push manufacturing limits.  READ MORE...

  • A Guide to Flexible and Rigid-flex PCBs.

    A Guide to Flexible and Rigid-flex PCBs.

    What is a flex PCB?  READ MORE...

  • UHDI Solder Mask Considerations

    UHDI Solder Mask Considerations

    Can solder mask tolerance follow UHDI's lead?  READ MORE...

Homepage Slideshow

  • Tolerances and Dimensions for PCB Fabrication

    The tolerances decide what actually ships.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19202-tolerances-and-dimensions-for-pcb-fabrication

  • How to Avoid 'Ghost Manufacturing'

    Hidden subcontracting can expose providers to latent quality risks.

    https://pcdandf.com/pcdesign/index.php/current-issue/270-board-buying/19199-the-phantom-menace-of-pcb-purchasing-how-to-avoid-ghost-manufacturing

  • Flex Circuits for Use in Catheters

    Long, narrow flex circuits push manufacturing limits.

    https://pcdandf.com/pcdesign/index.php/current-issue/243-flexperts/19205-flex-circuits-for-use-in-catheters

  • A Guide to Flexible and Rigid-flex PCBs.

    What is a flex PCB?

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19208-a-guide-to-flexible-and-rigid-flex-printed-circuit-boards

  • UHDI Solder Mask Considerations

    Can solder mask tolerance follow UHDI's lead?

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19210-uhdi-solder-mask-considerations

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Dow Debuts Pallamerse ENEPIG Finish

Published: 27 October 2009

Pallamerse SMT 2000 electroless palladium final finish is for use in ENEPIG (electroless nickel electroless palladium immersion gold) processes for both SMT and gold wire bonding assembly applications. Has lower gold content, yet sustains uniform gold thickness distribution and reliable solderability with reduced gold consumption.

Dow Electronic Materials, www.dow.com

 

 

 

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