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  • Choosing the Right Surface Finish

    Choosing the Right Surface Finish

    Balancing environment, shelf life – and cost.  READ MORE...

  • Elements of PCB Panelization

    Elements of PCB Panelization

    Panelize to optimize: faster builds, better boards.  READ MORE...

  • Flexible Heater Temperature Limits

    Flexible Heater Temperature Limits

    How high can they go?  READ MORE...

  • Collaborating with Service Bureaus

    Collaborating with Service Bureaus

    Time-to-market advantages encourage getting designs to scale quickly.  READ MORE...

  • Optimizing Mixed Signal Circuit Designs

    Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.  READ MORE...

  • Developing Organizational Culture for Troubleshooting

    Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.  READ MORE...

Homepage Slideshow

  • Choosing the Right Surface Finish

    Balancing environment, shelf life – and cost.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18837-choosing-the-right-surface-finish-for-a-pcb

  • Elements of PCB Panelization

    Panelize to optimize: faster builds, better boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18838-elements-of-pcb-panelization

  • Flexible Heater Temperature Limits

    How high can they go?

    https://www.pcdandf.com/pcdesign/index.php/current-issue/243-flexperts/18834-flexible-heater-temperature-limits

  • Collaborating with Service Bureaus

    Time-to-market advantages encourage getting designs to scale quickly.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18832-collaborating-with-service-bureaus-to-optimize-production-costs-and-lead-times

  • Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18794-optimizing-mixed-signal-circuit-designs

  • Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18798-developing-organizational-culture-for-troubleshooting

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  • Dow Debuts Pallamerse ENEPIG Finish

Dow Debuts Pallamerse ENEPIG Finish

Published: 27 October 2009

Pallamerse SMT 2000 electroless palladium final finish is for use in ENEPIG (electroless nickel electroless palladium immersion gold) processes for both SMT and gold wire bonding assembly applications. Has lower gold content, yet sustains uniform gold thickness distribution and reliable solderability with reduced gold consumption.

Dow Electronic Materials, www.dow.com

 

 

 

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