IQ-Bond 5976-ACE printed electronics adhesive provides adhesion strength on different flex and rigid substrates, such as PET, polyimide, FR-4, copper, aluminum and silver.
Has been tested in moisture (85°C/85%RH – 1,000 hr.), as well as temp. cycling (-40°C/+125°C) testing. Cures in seconds with thermode or induction curing systems, enabling assembly of 20,000 to 40,000 microchips per hr. on flip-chip production systems.