Printed Circuit Design & Fab Online Magazine - Features

Features

Assemblers demand a complete CAD data package for more effective manufacturing.

Panelization, also known as the processing of boards in an array format, keeps small boards attached to each other within a single, larger substrate. Panelization is used to process multiple small boards through assembly, and is becoming more prevalent as board sizes shrink.

Printers are becoming more and more versatile. Now they can even print sensors and electronic components on 2D and 3D substrates. A new, robot-assisted production line allows the process to be automated.

Are you losing sleep over power integrity on your boards? If so, this is for you.

The electronics assembly industry (along with a few fabricators) agrees that better times are ahead in 2014.

IPC Apex Expo in late March was judged by most to be a success, with attendance showing some signs of life, and a lot of machines listed SOLD signs.

Results of a cross-industry team’s development and testing of a PCB-based embedded chip technology for an under-the-hood automotive application.

Over the past five years, laminated-based chip embedding has taken a huge step toward industrialization.

Stencil design software has evolved from simple rule checkers to custom, sophisticated engineering tools.

QFNs, microBGAs and 0201s keep showing up everywhere. They used to appear only on boards requiring miniaturization; now they are used on revisions of legacy products, bringing a new set of headaches for process engineers.