Features

Just when the industry thought the shortage saga was over, the parts giant hit refresh on the chaos.

The global electronics industry faces another shortage situation. What began as a governance dispute between the Dutch government and the Chinese ownership of Nexperia has morphed into a geopolitical crisis with wide-ranging impacts on the printed circuit board assembly industry.

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The real bottleneck isn’t the layout; it’s decoding those half-hidden specs stuffed into a PDF.

Every electronics engineer and PCB designer knows the feeling: the design is done, the data package is zipped, and the request for quote (RFQ) is sent. And then ... you wait.

This is the quoting “black box.” A project’s momentum comes to a halt, sometimes for days, as you wait for a price. When the quote finally arrives, it might come with design for manufacturability (DfM) queries, unexpected costs or lead times that jeopardize the entire schedule.

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How a longtime PCB supplier became a contract manufacturer.

More than a handful of US-based printed circuit board fabricators offer some degree of assembly in order to meet customer demand. Often, these companies are flex circuit manufacturers which add in-house SMT as a strategic advantage so they can offer a one-stop supply model.

Recently, however, a Chicago-area supplier of bare PCBs took a different approach: It acquired, of all things, a full-service EMS company.

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And practical steps to exorcise the chemistry demons.

Each fall brings ghosts, goblins and, if you’re not careful, a few monsters lurking right inside your plating tanks. They won’t knock on your door or ring a bell, but they will hide in your agitation systems, anodes and cables. If ignored, they can turn a good product into scrap before you even notice.

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Good engineering isn’t just about power; it’s about knowing where not to over-engineer.

As modern electronic devices combine RF, high-speed digital and power circuitry on a single PCB, the demand for tailored electrical performance continues to increase. A hybrid material stackup is often adopted to meet such mixed-signal requirements, especially in RF applications where signal integrity, controlled impedance and low dielectric loss are crucial.

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Optimizing interconnects, fanouts and signal structures before schematic capture.

As printed circuit boards (PCBs) grow denser, faster and more power-constrained, designers face mounting challenges maintaining signal integrity, power efficiency and manufacturability. Traditionally, most optimization occurs after schematic capture – during placement and routing – when it’s often too late to remove structural inefficiencies.

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