WEST CHICAGO – Anaya Vardya, president of American Standard Circuits Sunstone, announces that his company has signed a licensing agreement with Precision Circuit Technologies (PCT), an operating unit of LCP Medical Technologies LLC. ASC Sunstone is now a licensed manufacturing partner for PCT’s high performance, high density, multi-layer Laminated Liquid Crystal Polymer (LCP) technology.
This technology will give ASC Sunstone the ability to provide customers PCBs with:
Up to 30 layers of LCP with sequential laminations
Sub 25-micron lines and spaces
Additive processing with 1 micron control of circuit geometries for 1-2% impedance control
Low loss performance beyond 120 GHz wireless and 112 gbps-224 gbps-448 gbps high speed digital
Solid copper full metal stacked vias through all layers
High speed flex, rigid-flex, rigid boards, RF MW modules and advanced semiconductor package substrates
This relationship establishes ASC Sunstone as a LCP production technology leader with a reliable manufacturing process that has been lacking in the industry. ASC and PCT will support customers jointly with dedicated applications and engineering support to provide sophisticated and complex high-performance circuits designed to meet next generation system speeds and circuit density requirements. The material set performance, design-rule based engineering and precision control of the circuit geometries provide unmatched capabilities compared to ABF, Polyimide, and other laminate construction. No other technology and material set can provide this level of density and performance across Flex, Rigid-Flex, Rigid Boards and Package Substrates and ASC will be the US standard.
This agreement enhances ASC’s position as a supplier of Ultra High-Density products in the RF/Microwave, Flex, Medical and Digital markets using advanced materials and creates a synergy with LCP Medical’s mutual customer relationships.
As a leading manufacturer of technology interconnect solutions, ASC Sunstone can now offer a new set of solutions to its customers based on the unique properties of LCP materials in the focused markets served today and opening new opportunities.
When making the announcement Mr. Vardya said, “As a longtime admirer of Jim Rathburn’s technology and contributions to our industry it is a true pleasure to finally be working with him. We feel being able to offer our customers such a high level of technology that LCP materials provide is another giant step in our effort to be the leading independent PCB fabricator on the market today. LCP technology combined with our Ultra HDI capabilities make ACS the go-to company for companies looking for tomorrow’s solutions today.”
Added James Rathburn, founder and president, LCP Medical Technologies LLC, “We feel that American Standard Circuits is the perfect partner for Precision Circuit Technologies PCB Liquid Crystal Polymer technology. They have all the experience, equipment and most importantly desire to not only produce but also take this technology of the future to market. We expect great things not only for our company and ASC Sunstone but for the industry as a whole to come out of this partnership going forward.”
Chiplets improve chip yields and costs but still provide the performance of a large monolithic chip. Designers can mix and match chiplets, use the process technologies best suited to specific functions, take advantage of chiplet IP, and simplify moves to new process nodes, avoiding wafer waste and manufacturing defects. Chiplets are the key to producing the extremely high-density, high-performance chips required for today’s networking, storage, AI/ML, analytics, media processing, HPC, and virtual reality applications.
Chiplet Summit covers the latest architectures, development platforms, and applications. It includes pre-conference seminars, keynotes, annual updates, and paper and panel sessions. It covers all aspects of chiplet development, including design, interconnect, packaging, integration, and testing.
At Chiplet Summit 2024, Principal Analyst, Computing Tom Hackenberg and Technology & Cost Analyst, Computing Ying-Wu Liu from Yole Group present a “Market Research Update” in the leadoff plenary on “Chiplet Markets Are Rising: Where and When?”
In addition, Tom Hackenberg heads an expert panel on market research in the closing session which will discuss market trends in “Chiplets in 2028 and How We Got There” and provide a keynote for the Open Compute Platform Track. This panel discussion will be moderated by Bill Wong, Technology Editor for Electronic Design. In addition to Tom, panelists include John Shalf from Lawrence Berkeley Laboratory, Bapi Vinnakota from the Open Compute Project, and Jawad Nasrullah from Palo Alto Electron. More info.
Be sure to meet Yole Group’s computing analysts at Chiplet Summit 2024; book a meeting with them now: This email address is being protected from spambots. You need JavaScript enabled to view it..
ATLANTA — ECIA is pleased to announce the 2024 Executive Conference Core Committee. Previously announced Chair Ken Bellero, Schaffner, and Co-Chair Maryellen Stack, Sager Electronics have finalized the core committee of returning and new members who already have hit the ground running for the best conference yet.
Pam Berigan, Sager Electronics
Lori Bruno, LuscomBridge
Tobi Cornell, Kruvand Associates
Robert Derringer, Crouzet
Juliet Fajardo, TDK-Lambda
Heather Fulara, DigiKey
Bob Garcia, Ferrari Technical Sales
Nicolle Ladouceur, ROHM Semiconductor
“I am really looking forward to working with this talented group of people,” commented Stephanie Tierney, ECIA’s Director of Member Communications and Member Engagement. “2023 was a record-breaking conference on many levels: sponsorships, attendance, survey responses and more were all ahead of the year before. This group has already vowed to surpass those records, and it will be fun working with them to meet the ambitious goals they have set for the 2024 Conference,” she continued. “All I can say is, ‘Watch out for another great event planned by this fantastic committee!’”
Subcommittees will be announced soon. For more information, go to https://www.eciaexecconference.org/. Sponsorship opportunities have been released and are filling up fast!
WASHINGTON – Printed circuit boards are prioritized in a December 12, 2023 report from the House Select Committee on the Strategic Competition Between the United States and the Chinese Communist Party:
Of 150 recommendations #1 is to strengthen domestic manufacturing of printed circuit boards and reduce reliance on adversary nations for microelectronics
Department of Defense:
The recently released National Defense Industrial Strategy focuses on creating resilient supply chains including microelectronics. The DoD has identified the need to expand domestic production and invest in a skilled workforce.
Congress has also obligated approximately $150 million for investments in microelectronics using the Defense Production Act. Two recent awards include:
$46.2 million to GreenSource Fabrication LLC via the Defense Production Act Investment Program. The award will enhance existing production capabilities at a manufacturing facility of state-of-the-art integrated circuits (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), and advanced packaging.
$39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics Corporation to enhance capabilities to produce High-Density Build-Up (HDBU) substrates, which include High-Density Interconnect Printed Circuit Board (PCB) cores and HDBU build-up layers.
While these actions are helpful, America needs to make a sustained, robust investment in manufacturing the microelectronics that power all aspects of modern life. The Printed Circuit Board Association of America and IPC have jointly called on Congressional appropriators to increase DPAI funding for microelectronics.
“Report after report coming out of Washington highlights our overreliance on Asia for microelectronics and the pressing need to make more printed circuit boards and substrates in America," said PCBAA Executive Director David Schild. "The current situation puts our national and economic security at risk. Congress and other agencies of government must act to reduce our dependency on foreign nations for the components that power national security and critical infrastructure systems.”
SAN DIEGO, CA – Pre-registration is now open for Chiplet Summit's second annual event on February 6-8 at the Santa Clara Convention Center. Hundreds of registrants and many key exhibitors will be at the premier showcase for chiplet technology. All major chip makers have adopted chiplets as their approach to producing devices at leading-edge nodes.
The event will cover the latest architectures, development platforms and methods, and applications. Expert panels will discuss best choices, likely breakthroughs, optimization, and long-term trends. Pre-conference seminars will focus on chiplet basics, packaging methods, interfaces, design methods, working with foundries, AI in chiplet design, and the Open Chiplet Economy. Other features include a high-powered superpanel on “How Can Chiplets Accelerate Generative AI Applications?”, an expert table session (with beer and pizza), and an annual update of technologies and markets.
Industry-leading keynotes offer designers insight into trends and roadmaps. Speakers represent Applied Materials, Synopsys, Micron, Alphawave Semi, Hyperion Technologies (introducing a new packaging technology with larger packages and a 1000W power budget), and Open Compute Project (OCP). Their focus is on methods for designing processors, coprocessors, communications devices, and graphics and AI chips.
“We now see the full impact of chiplets. They allow designs to include off-the-shelf components as well as drop-ins from older process nodes,” said Chuck Sobey, Summit General Chair. “They are ideal for applications such as AI that demand more processing power, faster response time, and the ability to handle more data. Chiplet Summit will help designers make the right decisions for current projects and future needs.”
Chiplet Summit also features innovative products from industry leaders such as Applied Materials, Synopsys, Alphawave Semi, Open Compute Project, Achronix, Arm, Cadence, and Siemens EDA.
SANTA ANA, CA – TTM Technologies, Inc. has donated $20,000 to the international humanitarian organization, Rise Against Hunger, through its TTM Chair of Community Service Award. The donation was made on behalf of TTM's West Region and Global Headquarters as part of their efforts to help those in need.
TTM's West Region partnered with Rise Against Hunger to launch a two-day meal packaging event in May 2023, where employees volunteered to package nutritious meals for people in developing countries. The goal was to package 10,000 meals per site, totalling 60,000 packaged meals. Across the six events spread through each TTM location in California, 360 TTM volunteers packaged 60,912 meals, which have already been shipped to developing countries. Their efforts have helped feed 360,000 individuals, which equates to nearly 5 tons of nutritious and impactful meals.
The TTM Board of Directors and Executive Team established the TTM Chair of Community Service Award in recognition of retired TTM Board Chairman Robert Klatell's community leadership and public service. Every year, this award recognizes a team of employees who selflessly contribute their time and abilities to positively impact communities through their service.
Shawn Powers, Executive Vice President and Chief Human Resources Officer said, "We are extremely proud of our employees for their hard work and dedication to this noble cause. Their efforts have significantly impacted many people's lives in developing countries, and we are honored to have made a positive contribution."
Megan Wolf, Donor Engagement Director for Rise Against Hunger, who was present at the global headquarters to receive the donation, thanked TTM for their generous donation and partnership in fighting hunger and malnutrition worldwide.
