DOWNERS GROVE, Ill.  -- SWEP, part of Dover (NYSE: DOV) and a world-leading supplier of brazed plate heat exchangers (BPHEs), today announced a partnership with Microchannel Devices (MCD) to expand SWEP's market offering with printed circuit heat exchangers (PCHE).

Both companies provide high-performing heat exchangers designed to optimize system efficiency, reduce footprint, and support more sustainable energy solutions. MCD's printed circuit technology complements SWEP's brazed plate technology and further enhances its portfolio of energy-efficient solutions.

"This partnership provides SWEP access to complementary products, while MCD benefits from accelerated market reach through SWEP's global sales channels and strong customer relationships. Our collaboration is a valuable opportunity to strengthen SWEP's position in existing markets and enhance our ability to serve customers through an expanded BPHE offering," says Ulrika Nordqvist, SWEP President.

SWEP and MCD share a strong commitment to the green energy transition and market development in areas such as hydrogen infrastructure, energy storage, and CO2 applications. The partnership enhances SWEP customer value by leveraging expanded application and technical expertise to meet demanding development requirements, particularly in applications characterized by space constraints, ultra-high working pressures, and extreme temperatures.

Through the buy-resell agreement, SWEP customers will gain access to a broad portfolio of ultra-compact heat transfer solutions through their trusted, long-term business partner, ensuring seamless dialogue and established procurement processes. The expanded PCHE offering is supplied by MCD, an Italy-based specialist in chemical etching, which delivers high-quality, certified PCHEs through its patented diffusion bonding and fully integrated design, production, and testing capabilities.

Canton, MA — April 2026 — Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026), taking place April 28–30, 2026, at the Renaissance Los Angeles Airport Hotel.

Recognized as the premier event focused on the design, reliability, and application of electronic components for aerospace, defense, and space systems, CMSE 2026 brings together leading engineers, technologists, and innovators to address the industry’s most pressing technical challenges.

As part of the conference’s Day 1 technical program, Chandra Gupta, Director of Business Development at Remtec, will present “Innovative Ceramic Sub-Mounts and Heat Spreaders.” His session will explore advanced thermal management strategies critical to improving the reliability and performance of high-power electronic systems.

High-power semiconductor devices—such as amplifiers and DC-DC converters—face significant thermal challenges that can impact performance and long-term reliability. Dr. Gupta’s presentation will address how advanced ceramic materials and engineered sub-mount designs can dramatically improve heat dissipation, reduce thermal resistance, and extend mean time before failure (MTBF) in mission-critical applications.

“CMSE is one of the most important technical gatherings in our industry because it brings together the people who are solving the toughest reliability challenges in aerospace, defense, and space electronics,” said Mr. Buyea. “For Remtec, it’s an opportunity not just to showcase our technology, but to contribute to the collective advancement of high-performance, high-reliability electronic systems. The conversations that happen here—especially around thermal management and materials innovation—are critical to the future of our industry and the systems that depend on it.”

CMSE 2026 is designed to foster deep technical engagement through high-quality presentations, keynotes, and interactive discussions. The event also plays a vital role in educating the next generation of engineers, ensuring the continued advancement of technologies that support national defense and space exploration.
Remtec’s participation underscores its commitment to solving complex thermal and reliability challenges through advanced materials and integrated manufacturing solutions.

About Remtec

Remtec is a leading provider of advanced ceramic substrates and microelectronic assembly solutions, specializing in high-performance applications where thermal management, reliability, and signal integrity are critical. Leveraging proprietary technologies such as plated copper thick film (PCTF®), Remtec delivers solutions using materials like alumina and aluminum nitride to support demanding environments across aerospace, defense, telecommunications, and power electronics.

From substrate design to fully integrated assembly—including die attach, wire bonding, and system-level integration—Remtec provides end-to-end solutions that help customers improve performance, reduce risk, and accelerate time to market. With a strong focus on engineering collaboration and innovation, Remtec continues to push the boundaries of what’s possible in high-reliability electronics.

Worcester, MA — April 29, 2026 — Fineline Global, a leading global provider of advanced printed circuit board (PCB) solutions, today announced that it will be exhibiting at PCB East 2026 on Wednesday, April 29 at the DCU Convention Center in Worcester, Massachusetts. Visitors can meet the Fineline team at Booth 410 to learn more about the company’s comprehensive, technology-driven PCB offerings and its expanding presence in the North American market.

Fineline Global continues to build momentum across North America by delivering high-reliability PCB solutions backed by global manufacturing strength, advanced engineering support, and a customer-first approach. The company specializes in complex, high-tech applications including HDI, RF, rigid-flex, and advanced substrate technologies, serving industries such as aerospace, defense, medical, and industrial electronics.

“PCB East is an important opportunity for us to connect directly with engineers, designers, and decision-makers who are looking for more than just a supplier—they’re looking for a true global partner,” said Clive Wall, North American Director of Business Development at Fineline Global. “Our focus is simple: bring world-class PCB technology, backed by strong engineering and supply chain expertise, to customers who need performance, reliability, and responsiveness. We’re here to show that Fineline is ready to lead in North America.”

At Booth 410, attendees will have the opportunity to explore how Fineline’s integrated approach—from design support through production—helps reduce risk, improve performance, and accelerate time to market.

About PCB East 2026

PCB East 2026 is one of the premier events for printed circuit board design, fabrication, and assembly professionals in North America. Held annually at the DCU Convention Center in Worcester, Massachusetts, the event brings together engineers, designers, fabricators, and industry leaders for a full day of exhibitions, technical sessions, and networking opportunities. PCB East is known for its practical, hands-on focus and its ability to connect technology providers with real-world applications and challenges.

About Fineline Global

Fineline Global is a global PCB solutions provider delivering advanced technology, engineering expertise, and supply chain excellence to customers worldwide. With a strong presence across Europe, Asia, and North America, Fineline offers a complete range of PCB technologies including HDI, RF, rigid-flex, and specialty substrates. The company’s mission is to help customers achieve their product goals through innovation, quality, and a commitment to long-term partnership. For more information go to www.fineline-global.com.

Visit Fineline Global at Booth 410 on April 29 at PCB East 2026 to learn how global capability meets local support—exactly where it matters most.

Worcester, MA: Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.
PCB Technologies will be exhibiting at Booth 101, where attendees can learn firsthand why the company has become one of the most advanced and complete high-tech PCB solution providers in the world.

PCB East 2026 features a four-day technical conference from April 28 through May 1, with the one-day exhibition on April 29 bringing together leading innovators, manufacturers, and technology providers across the electronics industry.

“We are excited to be part of PCB East 2026 and to connect with engineers, designers, and decision-makers from across North America,” said Mr. Ende. “This event gives us the opportunity to demonstrate how our All-In-One approach—from design through fabrication, assembly, and advanced packaging—helps customers accelerate innovation, reduce risk, and bring better products to market faster.”

About PCB-Technologies:

PCB Technologies is known for delivering a complete high-tech PCB solution under one roof, combining advanced capabilities in HDI, RF, rigid-flex, IC substrates, and complex assembly. Their unique integrated model eliminates the traditional gaps between design, fabrication, and assembly—resulting in improved performance, faster turnaround, and greater reliability for mission-critical applications in aerospace, defense, medical, and high-performance electronics.

At Booth 101, visitors will discover how PCB Technologies is redefining what it means to be a true manufacturing partner—offering not just boards, but complete solutions that help customers achieve their end-product goals with confidence.

Attendees are encouraged to visit PCB Technologies during the exhibition to explore their capabilities, meet the team, and learn how they are helping shape the future of electronics manufacturing. For more information go to www.pcb-technologies.com

About PCB East 2026

PCB East 2026 is where serious electronics professionals go to get better, faster, and more competitive. Held April 28 through May 1, 2026, at the DCU Center in Worcester, this is the East Coast’s most important event for PCB design, fabrication, and assembly. Hosted by Printed Circuit Engineering Association, PCB East delivers hands-on training, real-world solutions, and direct access to the companies driving innovation in electronics manufacturing. Engineers, designers, and decision-makers attend for one reason—practical knowledge they can use immediately to build better products and win in a faster-moving market. If you want to stay relevant in electronics, this is where you show up.