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  • Onderdonk's and Preece's Equations: How Do They Compare?

    Onderdonk's and Preece's Equations: How Do They Compare?

    Two unique equations can be used when fusing a trace – each offering its own strengths and weaknesses.
      READ MORE...

  • Simulating Electronics Components in the Cloud

    Simulating Electronics Components in the Cloud

    Methods for assessing component temperatures and fan performance.
      READ MORE...

  • Cpk or Ppk? A Look at Using Both Capability Indices

    Cpk or Ppk? A Look at Using Both Capability Indices

    Summary statistics can be misleading, but in different ways.
      READ MORE...

  • The West is Rediscovering India

    The West is Rediscovering India

    The subcontinent explodes with new EMS work, prompting a spate of IPOs.
      READ MORE...

  • Thermal Considerations for Printed Circuit Board Designers

    Thermal Considerations for Printed Circuit Board Designers

    Leave more metal behind.
      READ MORE...

Homepage Slideshow

  • Onderdonk's and Preece's Equations: How Do They Compare?

    Two unique equations can be used when fusing a trace – each offering its own strengths and weaknesses.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17314-onderdonk-s-and-preece-s-equations-how-do-they-compare

  • Simulating Electronics Components in the Cloud

    Methods for assessing component temperatures and fan performance.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17315-simulating-electronics-components-in-the-cloud

  • Cpk or Ppk? A Look at Using Both Capability Indices

    Summary statistics can be misleading, but in different ways.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17313-cpk-or-ppk-a-look-at-using-both-capability-indices

  • The West is Rediscovering India

    The subcontinent explodes with new EMS work, prompting a spate of IPOs.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17316-the-west-is-rediscovering-india

  • Thermal Considerations for Printed Circuit Board Designers

    Leave more metal behind.


    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/17308-thermal-considerations-for-printed-circuit-board-designers

Tweets by @FrancesStewart5
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  • Final Finishes

Final Finishes

A ‘Promoter’ for Solder Mask Adhesion

Details
Written by Lenora Toscano
Category: Final Finishes
Published: 01 October 2014

Lenora Toscano

A rough topography aids reliability even while it complicates wet processing.

Read more: A ‘Promoter’ for Solder Mask Adhesion
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