2007 Issues

Nanomaterials provide the basis for flexible embedded components that meet the demands of new low-cost, large-area, flexible and lightweight devices.

Read more: Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors
Image Read more: EMI/EMC Concerns for High-Speed Differential Signals

Collaborative tools bring chip, package and PCB designer together to improve the system design process.

Read more: The Need for PCB Driven I/O Planning

High frequency digital signals require complex models to accurately simulate the signal’s path.

Read more: Modeling Issues in High-Speed Simulation
Kathy Nargi-Toth Read more: New Money

The printed circuit board will continue to be the “work-horse” of interconnection technology.

Read more: The Organic Interconnect Roadmap

Page 9 of 21