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  • What is Ultra HDI?

    What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.  READ MORE...

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2007 Issues

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Category: 2007 Issues

Filled via-in-pad processes are a way to achieve an intermediate density increase for a minimal additional cost.

Read more: The Implementation of Via-in-Pad Interconnects to Increase PCB Circuit Density

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Category: 2007 Issues

Via fill for via-in-pad designs improves manufacturability from board fab through assembly.

Read more: Copper Via Fill – A Solution for HDI Via-in-Pad

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Category: 2007 Issues
Dr. Eric Bogatin
Read more: Looking Under the Sheets at Resistance

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Category: 2007 Issues
Peter Bigelow
Read more: Tainted Toys

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Category: 2007 Issues

The economic model for the optoelectronic interconnect favors high data rate transmission over moderate to long distances, limiting applications to high-end telecommunication systems.

Read more: Optoelectronic Substrates – Will it Happen?

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Category: 2007 Issues

Choose library tools that store component and land pattern data in a generic format that can be used with any CAD tool.

Read more: Building and Maintaining CAD Libraries

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