Searay high-speed, high-density connectors come in 1.27 X 1.27mm open pin field grid array, with no pins dedicated as signal or ground.
Meteorwave 3350 copper-clad laminate is for radio frequency applications requiring a tightly controlled 3.5 Dk.
M-Ply prepreg is for radio frequency/digital hybrid bonding.
TechniPad 7611 electroless process deposits pure palladium on electroless nickel.
PDR IR-E3M micro component/PCB rework system is for extreme micro-rework applications.
B-730, B-731 and B-421 laser markable materials complement Ultratemp labels specifically designed for printed circuit board and electronic component applications.