Products

CX90MW waterproof USB 3.2 Gen 1 Type-C connector is for applications that require miniaturization with resistance to liquid, vibration and/or shock.

Read more: Hirose Releases CX90MW Connector

ICCON Block and ICCON Insert connectors address high current rating demands from high-speed board-to-board and board-to-busbar data communication applications.

Read more: TE Connectivity Releases ICCON Block, ICCON Insert Connectors

VEMD4010X01 and VEMD4110X01 surface-mount automotive-grade silicon PIN photodiodes come in 0805 case size with 0.7mm profile.

Read more: Vishay Introduces VEMD4010X01, VEMD4110X01 Photodiodes

Blackhole LE and Eclipse LE modified semi-additive processing (mSAP) for direct metallization enable direct copper electroplating to laminate walls and copper target pads of microvia structures without need for intermediary copper layers from electroless or electrolytic flash plating.

Read more: MacDermid Alpha Releases Blackhole LE, Eclipse LE mSAP

inspectAR 2.3 includes the ability to add comments within the context of the PCB, create custom names and save overlay sets.

Read more: InspectAR Releases inspectAR 2.3 PCB Debugging Tool

Tec-Speed 20.0 VT-870 H348 TCR laminate is available in Hoz- and 1oz-thick foil with resistivity values of 25, 50 and 100Ω/sq. Tec-Speed 20.0 glass-reinforced hydrocarbon and ceramic laminate with thin-film resistor material is now available with Ticer TCR NiCr thin-film resistor foil as a service option.

Read more: Ventec Launches Tec-Speed 20.0 VT-870 H348 TCR Laminate

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