Amphenol RF's multiport AUTOMATE Type A Mini-FAKRA series now includes single and dual-port right-angle connectors, along with straight and right-angle configurations for the existing quad-port version, increasing the design capabilities of the series and allowing it to be utilized in a wider array of automotive and industrial applications where higher data transmission rates are required.
Peters' Elpemer solder resist SD 2463 FLEX-HF features state-of-the-art physical and mechanical properties, including ink that is flexible under bending stress when the circuit board is installed. Capable of reliably covering all areas of a PCB that shall not receive solder in subsequent soldering processes, and includes hardness and scratch resistance after final curing to protect the PCB from mechanical damage.
Stackpole Electronics' RNCF series of precision thin film resistors is designed for markets such as medical instrumentation and control, industrial and automotive controls, communications, and test & measurement.
Mechnano's Tough ESD is an additive manufacturing (AM) resin based on its Mech T technology that utilizes the power of discrete Carbon Nanotubes(dCNTs).
Ventec's tec-speed 20.0 VTM1000i hydrocarbon laminate is designed for for antenna and communication systems, radar, and aviation systems, and is available in a range of dielectric thickness, with 0.38mm through to 3.81mm options, while offering a high decomposition temperature (Td) of 426°C.
Fujipoly America's CF210A thermal gap filler incorporates carbon fibers along with traditional fillers. Carbon fibers allow for higher thermal conductivity while remaining compliant. Compliance is closer to a much lower conductivity gap filler such as SARCON® PG25A. Has a stable thermal resistance, regardless of compression.