Duraposit SMT-810 electroless nickel solderable final finish is said to have longer bath life and improved deposit uniformity. For use with Aurolectroless SMT 520 immersion gold. Features corrosion resistance and solderability which is maintained at both high and low bath loading and throughout the solution life. Self-adjusting pH simplifies bath operation. Fine Ni grain deposits around annular ring and pad corner, for gold adhesion and to reduce gold peel-off. Lower Ni content make-up at Ni 5g/L can reduce waste water discharge.

Dow Electronic Materials, http://www.dowelectronicmaterials.com/products/printed_circuit_boards/hdi/duraposit-smt_810.htm

CBT-MLI 5800 digital imager handles 45 micron and above inner- and outerlayers. Also comes in 30 micron unit. Has fully automated loader/unloader. Reportedly can be programmed in under a minute and processes up to 60 panels an hour.

Chime Ball Technology (CBT), www.cbtech.com.tw

Maskless Lithography, www.maskless.com

Atlas PCB insertion loss test system combines bidirectional SET2DIL and capability for short pulse propagation. Can support customers using either primary method for using TDR for insertion loss measurement as outlined in IPC-TM-650. Supports 20GHz, 30GHz and 50GHz bandwidth sampling heads. Can use in combination with Si9000e boundary element field solver; can be used as a standalone insertion loss test system or used in conjunction with signal-integrity tools that include impedance modeling and stack-up design, as well as coupon design and generation systems.

Polar Instruments, www.polarinstruments.com
 

CupraPro S8 pretreatment for acid copper plating meets current regulations for biodegradability for cleaners required in the EU and is free of NPE (nonylphenol ethoxylates) and PFOS (perfluorooctane sulfonates). Is said to have a very low surface tension and fast wetting speed. For all panel and pattern plating applications.

Atotech, www.atotech.com