News

CAMBRIDGE, UK – Flexible hybrid electronics promises to combine the extensive processing capability of ICs with a flexible form factor, and with printed rather than etched conductive interconnects. This combination of attributes opens application possibilities and could be a $3 billion market by 2030, according to IDTechEx.

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SCOTTSDALE, AZ – Worldwide IC unit shipments will register their first-ever back-to-back annual decline in 2020, according to IC Insights.

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