SOUTHPOINTE, PA – ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
 
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
 
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
 
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
 
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
 
 
 
 

SAN JOSE, CA and TOKYO – As part of its companywide initiative to reduce design cycle time and improve efficiency, Hitachi Ltd. has employed Cadence Design Systems’ Global Route Environment (GRE) technology for Allegro PCB design.
 
Hitachi reports the measure has reduced PCB place-and-route design time by 40% for high-speed communication products.
 
The company used the GRE technology on its PCB place-and-route from interconnect planning to complete routing, with full constraints for high-speed digital signals where automation had not been previously available.
 
Hitachi feels the technology will also be effective for other PCB design challenges, such as engineering changes and routing estimation. It plans to use GRE as a standard solution throughout the design environment.
 
GRE technology provides automaton for various stages of interconnect planning and routing where no automation has been available.