LYON, FRANCE – Fan-out packaging adoption has grown in the past year, with TSMC the leader, according to a new report from System Plus Consulting and partner Yole Développement. Samsung subsidiary Semco is most likely second, say the firms, with PTI as a potential OSAT outsider in FO.
TAOYUAN CITY, TAIWAN – Taiwanese PCB manufacturers had 2019 revenues of NT$662.4 billion (US$21.4 billion), up 1.7% compared to 2018, according to the Taiwan Printed Circuit Association.