Printed Circuit Design & Fab Online Magazine - Design News

Design News

Details: Written by Staff; Category: Design News; Published: 09 September 2008

SMYRNA, GA – The PCB West 2008 two-day exhibition will be held on September 16 - 17, 2008, at the Santa Clara Marriott in Santa Clara, CA. The exhibition features a sold-out show floor of 46 exhibiting companies, each displaying and demonstrating the lastest products, services and technologies for the printed circuit board (PCB) design industry.

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Details: Written by Staff; Category: Design News; Published: 08 September 2008

OLATHE, KS -- Bogatin Enterprises and the IEEE (Institute of Electrical and Electronics Engineers) announce new Professional Development Certification courses to be given in conjunction with the IEEE’s Educational Partner’s Program. This series of courses, scheduled to begin in January 2009, will cover the latest in high-speed design, simulation and modeling techniques. Each course will provide 40 hours of instruction through a combination of on-line and classroom modules.

Details: Written by Staff; Category: Design News; Published: 08 September 2008

MILTON KEYNES, UK -- Labtech Microwave has appointed Stephen Melvin as a principal engineer for MMIC (monolithic microwave integrated circuits) packaging and LCP (liquid crystal polymer) products.

Prior to joining Labtech Microwave Mr. Melvin was the senior design engineer for RFMD (formerly Filtronic Compound Semiconductors), where he designed MMICs for power amplifiers as well as microwave radio components and broadband MIC (microwave integrated circuit) amplifiers for EW (electronic warfare) applications.

Details: Written by Staff; Category: Design News; Published: 04 September 2008

AURORA, IL– As part of its role for the Advanced Materials for Ubiquitous Leading-edge Electromagnetic Technologies (AMULET) research project, Vector Fields has provided antenna developers with enhanced design tools to simulate metamaterial structures as a way to reduce the costs and the size in wireless production. Metamaterials can be used to tailor the effective impedance of a substrate or ground plane, to improve an antenna’s radiation pattern and efficiency. Metamaterial structures could additionally be used to integrate common filtering requirements such as band pass filters into the two-dimensional PCB structure, to reduce the cost and size of a wireless product's electronic bill of materials (BOM). The company plans to add modeling support for any future developments that come as AMULET begins to explore the use of active metamaterials.

SMYRNA, GA – UP Media Group, parent company of Circuits Assembly and Printed Circuit Design & Fab, announced The Future of ECAD-MCAD Collaboration Webinar would be broadcast Sept. 23 at 2 p.m. EDT.

INDIANAPOLIS– AT&S has chosen Cimnet Systems’ pre-production engineering application Engenix and the Direct Logix Control Center Solution as the engineering automation solution for all six of the company’s facilities. Engenix includes tools for job management, pre-production engineering and communication and collaboration, and will be used to continue the development of advanced engineering tools in order to meet changing PCB technology. The PCB-specific software will serve to improve production by integrating incoming processes and data smoothly, and the company expects to reduce the cycle time for new jobs by at least 50%.

“As the multi-site, global manufacturing of printed circuits continues to develop, this centralized engineering technology will help users achieve lower costs, faster responsiveness and improved business positions,” explains Leigh Eichel, vice president of Direct Logix.